» Program » Laser Technology Live » Nano-Processing


E 112.3
Nano and Micro Structuring with High Speed Scanner
A high-speed scanner with small focus (<1?m) is used with a 1.5W fs fiber laser to process dielectrics. With this set up the fabrication of waveguides, in-volume marking and surface nano-structuring for different applications becomes productive.

Moreover the high speed modification of sapphire and fused silica and subsequent etching are used to fabricate 3D micro components of e.g. micro mechanical devices, miocro optics and micro fluidic devices.

Contact Person
Dipl.-Phys Maren Hörstmann-Jungemann
Phone +49 241 8906-472
Lehrstuhl für Lasertechnik LLT

Production Technology for Transparent, Conductive Nano Layers (PROTCF)
Nano-particulate dispersions have proven to be a powerful source for producing functional layers. Their application onto glass substrates by e.g. ink-jet processes is particularly challenging as the necessary thermal treatment of the dried films often requires temperatures that exceed the temperature stability of the substrate. With high processing speeds the laser beam offers the possibility to overcome these drawbacks; the thermal load of the substrate is minimized.

Indium tin oxide (ITO) for example is used as a transparent anode material for display and lighting devices, e.g. OLEDs. As the price of indium continues to increase it is crucial to decrease its loss in conventional masked sputtering processes or avoid cost-intesive vacuum sputter and lithography processes for structured coatings. This is achieved by printing the desired design at once and treating it with laser radiation to decrease the printed sheet resistance from several hundreds of kiloohms to less than 100 ohms per square.

Contact Person
Dipl.-Ing. Christian Vedder, Dr. Jochen Stollenwerk, Dr. Konrad Wissenbach
Phone +49 241 8906-378/ -411 / -147
Fraunhofer Institute for Laser Technology ILT

E 1160.3
Three-beam Laser Interference Technique to Generate Micro- and Nanostructures
In laser-interference technique the laser beam is split by two beam splitters into three coherent beams and recombined under a specific angle. By changing this angle of incidence it´s possible to generate different periodicities.

The three interfering beams are controlled by several mirrors to overlap on a three-dimensional adjustable stage for structuring the substrate. Three polarizers and half-wave plates are placed in the beam paths to control the polarization and the intensity of the interfering beams.

By changing the polarization of the interfering beams it is possible to get different intensity distributions. By means of these different intensity distributions we are able to produce micro cavities, micro bumps, rectangular bumps or grating lines on the surface of polymer materials without any further changes of the setup.

By means of a three beam laser-interference technique, it is possible to generate more than 100.000 of holes with a single burst. The number of required pulses depends on the type of material, absorption coefficient and the pulse energy.

Contact Person
Dipl.-Phys. Stefan Beckemper
Phone +49 241 8906-325
Fraunhofer Institute for Laser Technology ILT
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